Analysis of complex packaging model based on BGA

Author

Tian Wenchao ; Guan Rongcheng ; Zhao Laiqiang

Author_Institution

Sch. of Electro-Mech. Eng., Xidian Univ., Xi´an, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

630

Lastpage

634

Abstract

Ball grid array (BGA) has the characters of excellent heat dissipation and high mechanical strength to satisfy with the need of high density packaging of electro produces. However BGA faces some problems of complex viscoplastic deformation, difficult failure test and high repair cost. This paper establishes a complex multichip packaging module with lead-free solder ball SAC305 BGA solder ball based on nonlinear Anand viscoplasticity principle. The simulation results are obtained based on the IPC9701 standard thermal cycling condition. The PCB (printed circle board) warpage law and the positions of the dangerous chip and dangerous solder ball are found. The stain-stress change rule and hysteresis curve are also obtained. The lifetime of complex packaging model is analyzed based on Coffin-Manson equation. Result shows that model reliable working time is 399 hours during the IPC9701 standard thermal cycling environment.

Keywords

ball grid arrays; cooling; multichip modules; solders; BGA; Coffin Manson equation; PCB; ball grid array; complex packaging model; heat dissipation; high density packaging; hysteresis curve; lead free solder ball; mechanical strength; multichip packaging module; nonlinear Anand viscoplasticity principle; printed circle board warpage law; stain stress change rule; thermal cycling; time 399 hour; Electronic packaging thermal management; Equations; Materials; Mathematical model; Packaging; Strain; Stress; BGA; PCB warpage; fatigue life; package module; thermal cycling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756548

Filename

6756548