DocumentCode :
3479308
Title :
Novel Room Temperature Wiring Process of Ag Nanoparticle Paste
Author :
Wakuda, Daisuke ; Hatamura, Mariko ; Suganuma, Katsuaki
Author_Institution :
Osaka Univ., Osaka
fYear :
2007
fDate :
Jan. 16 2007-Yearly 18 2007
Firstpage :
110
Lastpage :
113
Abstract :
Ag nanoparticles protected by dodecylamine were formed into paste and successfully sintered at room temperature in air atmosphere. In order to remove the dodecylamine dispersant, Ag nanoparticles printed as lines on glass substrates were dipped in methanol for 10 s to 7200 s. As a result, the sintered wires possess excellent low resistivity, 7.3times10-7 Omegam after 7200 s dipping. From in-situ electrical resistance measurement, the electrical resistance of Ag nanoparticles becomes smaller as sintering time increases. Microstructural observation on room temperature sintering revealed that, as dipping time increases, Ag nanoparticles agglomerate to be coarsened, and connection among particles becomes clearer. Thus, a novel room temperature wiring method for Ag nanoparticles has been successfully developed in air atmosphere.
Keywords :
electrical resistivity; nanoparticles; silver; sintering; wiring; Ag nanoparticle paste; dipping time; dodecylamine dispersant; in-situ electrical resistance measurement; methanol; microstructural observation; resistance 7.3 muohm; room temperature sintering; room temperature wiring process; time 10 s to 7200 s; Atmosphere; Conductivity; Electrical resistance measurement; Glass; Methanol; Nanoparticles; Protection; Temperature; Wires; Wiring; Nanoparticle; Room Temperature; Silver; Sintering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2007. Polytronic 2007. 6th International Conference on
Conference_Location :
Odaiba, Tokyo
Print_ISBN :
978-1-4244-1186-3
Electronic_ISBN :
978-1-4244-1186-3
Type :
conf
DOI :
10.1109/POLYTR.2007.4339149
Filename :
4339149
Link To Document :
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