ACF (Anisotropic Conductive Film) Batch Bonding Connection changing Flip Chip Bonding technology

ACF (anisotropic conductive film) is the interconnecting material which was commercialized in 1977 by Sony Chemicals Corporation (now known as Sony Chemical & Information Device Corporation) for the first time in the world. At present, ACF is widely used in circuit board packaging for liquid crystal panels, LSI packaging, and so on, and therefore is well known as a commonly used interconnecting material. Since the world´s first ACF for CSP (chip size package) was put on the market in 1996, ACF has been the subject of widespread attention for its various advantages such as available batch packaging of multiple leads, achievable fine pitch designs and possible reduction in size and weight, and has been studied as a new method of flip chip bonding. Presently ACF is adopted in some packages for semiconductor devices including control and/or memory chips and in flip chip bonding on the substrate. This paper reports on the development of a new packaging technique which increases productivity and utilizes the unique characteristic of ACF-based packaging by devising its bonding process.