Title :
Ultrasound-assisted brazing of large area Cu/Al dissimilar metals used for package heat dissipation substrate
Author :
Yong Xiao ; Mingyu Li ; Jongmyung Kim
Author_Institution :
Shenzhen Grad. Sch., Harbin Inst. of Technol., Shenzhen, China
Abstract :
Cu/Al joints with large faying surface and high bonding ratio were fabricated with an ultrasound-assisted fluxless brazing method using a Zn-3Al near eutectic filler metal. The microstructure, tensile strength, and corrosion resistance of the joints were investigated in terms of brazing temperature. Results showed that, in the joint brazed at 440 oC, the filler metal layer showed a refined and dispersed microstructure, and a serrate Al4.2Cu3.2Zn0.7 IMC layer with a thickness of approximately 1.9 μm was found on the Cu interface. Decreasing the brazing temperature to 400 oC or increasing the brazing temperature to 480 oC both resulted in a coarsening of the filler metal layers, and a significant growth of the Cu interfacial layers. Tensile tests showed that all the Cu/Al joints were failed in the Cu interfacial regions, among which the joint brazed at 440 oC had the highest tensile strength of 78.93 MPa. Corrosion resistance tests showed that the joint brazed at 440 oC exhibited the smallest corrosion depth after immersing in a 3.5% NaCl aqueous solution for 40 days.
Keywords :
aluminium alloys; brazing; cooling; copper alloys; corrosion resistance; eutectic alloys; tensile strength; ultrasonic applications; zinc alloys; Al4.2Cu3.2Zn0.7; IMC layer; brazing temperature; corrosion depth; corrosion resistance; dispersed microstructure; eutectic filler metal; faying surface; filler metal layers; high bonding ratio; interfacial layers; interfacial regions; large area dissimilar metals; package heat dissipation substrate; pressure 78.93 MPa; temperature 400 C; temperature 440 C; temperature 480 C; tensile strength; tensile tests; ultrasound-assisted fluxless brazing method; Corrosion; Filler metals; Joints; Metals; Microstructure; Resistance; Substrates; Cu-Al brazing; Zn-Al alloy; corrosion resistance; microstructure; tensile strength; ultrasonic vibration;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756554