Fabrication of BGA solder balls by pulsated orifice ejection method

Author

Lu, Dan ; Xu, F.M. ; Zhao, Lu ; Fu, Y.F. ; Dong, Wenjie ; Tan, Yongdong ; Kawasaki, Akari

Author_Institution

Sch. of Mater. Sci. & Eng., Dalian Univ. of Technol., Dalian, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

694

Lastpage

697

Abstract

A new method named Pulsated Orifice Ejection Method (POEM) is proposed for fabrication of BGA solder balls with narrow size distribution and high sphericity. As for an orifice with a certain diameter, the diameter of solder balls is mainly affected by rod displacement and gas pressure. The size of solder ball linearly increases with the increase of both the rod displacement and the gas pressure within a certain range. The analysis of size distribution and sphericity shows that solder ball fabricated by POEM meets the requirements of BGA packaging. In addition, the solidification behavior of the droplets prepared by POEM is also discussed by theoretical calculation.

Keywords

ball grid arrays; solders; BGA packaging; BGA solder balls; gas pressure; high sphericity; narrow size distribution; pulsated orifice ejection method; rod displacement; Electronics packaging; Heat transfer; Microstructure; Orifices; Temperature measurement; Tin; BGA solder ball; High sphericity; Narrow distribution; Pulsated Orifice Ejection Method(POME);

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756561

Filename

6756561