A system for automated BGA inspection

Author

Wen-Yen Wu ; Chih-Chung Chen

Author_Institution

Dept. of Ind. Eng. & Manage., I-Shou Univ., Kaohsiung

Volume

2

fYear

2004

fDate

1-3 Dec. 2004

Firstpage

786

Lastpage

790

Abstract

For the advantages of high I/O count and small size, ball grid array (BGA) package techniques have been developing very fast in recent years. In this paper, a vision-based algorithm was proposed. The BGA grayscale images captured by CCD camera, and some image processing methods were applied to segment and enhance the image of solder ball. Three kinds of feature size were employed here: area, centroid and roundness of solder ball. The defects were detected by matching these features to the template data. The inspection items included missing ball, extra ball, ball bridging, oversize or undersize, offset and deformation. In this research, the speed execution time of inspecting one BGA image is also taken into consideration

Keywords

automatic optical inspection; ball grid arrays; computer vision; image enhancement; image matching; image segmentation; solders; BGA grayscale image; CCD camera; automated BGA inspection; ball grid array package technique; feature matching; image enhancement; image processing; image segmentation; solder ball area; solder ball centroid; solder ball roundness; vision-based algorithm; Charge coupled devices; Charge-coupled image sensors; Engineering management; Gray-scale; Image segmentation; Industrial engineering; Inspection; Labeling; Machine vision; Packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Cybernetics and Intelligent Systems, 2004 IEEE Conference on

Conference_Location

Singapore

Print_ISBN

0-7803-8643-4

Type

conf

DOI

10.1109/ICCIS.2004.1460688

Filename

1460688