The study on grinding process of flip chip wafers

IC technology changes with each passing day, developing towards the direction of higher integration, higher density and smaller size. The process of wire bonding can´t meet the requirements. FC(Flip chip) technology becomes more mature day by day. Bump interconnection is an important characteristic of flip chip, usually consisting of PbSn alloy or SnAgCu alloy. In order to ensure the effective interconnection between bumps and substrates, the bumps need keep coplanar. However, certain pressure will act on wafers during the process of grinding and taping. The question of how to protect bumps from deformation and How to reduce the damage layer after grinding will be studied Dicing is the process after grinding. Taping is also used before dicing. The technological process will be introduced.