DocumentCode
3479726
Title
Post-manufacturing effects of laser ablation process on ceramic-polymer composite substrates
Author
Mehdi, G. ; Hu Anyong ; Jungang Miao
Author_Institution
Sch. of Electron. & Inf. Eng., Beihang Univ., Beijing, China
fYear
2013
fDate
11-14 Aug. 2013
Firstpage
728
Lastpage
731
Abstract
Ceramic-polymer composite substrates are good choice for realization of microwave and millimeter-wave circuits in terms of cost vis-a´-vis performance. Unlike conventional photolithography printed circuits manufacturing, laser structuring offers the fastest, highly repeatable and most accurate manufacturing solution. In this work, the possibility of rapid prototyping of microwave and millimeter wave (MMW) circuits on low-cost ceramic-polymer composite substrates employing laser ablation process is investigated. The measured results indicate that the effective complex permittivity characteristics of the substrate are altered as a consequence of post laser ablation process effect. The effective permittivity alteration phenomenon is validated through the characterization and comparision of various laser ablated and chemically etched Ka band parallel-coupled band-pass filters followed by the permittivity analysis. A simple and experimentally verified method is proposed to utalize the laser ablation structuring process on the prescribed substrate. The method can be used for other substrates as well.
Keywords
band-pass filters; ceramics; composite materials; laser ablation; microwave circuits; millimetre wave circuits; permittivity; polymers; substrates; Ka band parallel coupled band-pass filters; ceramic-polymer composite substrates; chemical etching process; complex permittivity; effective permittivity; laser structuring; microwave circuits; millimeter wave circuits; permittivity analysis; post laser ablation process; post manufacturing effect; rapid prototyping; Band-pass filters; Frequency measurement; Laser ablation; Masers; Permittivity; Substrates; Transmission line measurements; Ceramic-polymer; laser ablation process; microwave; millimterwave;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location
Dalian
Type
conf
DOI
10.1109/ICEPT.2013.6756569
Filename
6756569
Link To Document