Dynamic characteristics analysis of the flip chip bonding head based on multiple working conditions

With rapid development of very large integrated circuit, flip chip bonder (FCB) becomes an important microelectronics package device. Bonding head in FCB is one of the most important functional components used to deal with the process of chip bonding and is of the highest motion precision. Since both resonance and additional vibration in bonding head significantly affect the working precision, therefore, it is very meaningful to investigate its vibration characteristics. Modal analysis is a common method to study the structural dynamics characteristics. In this paper, the inherent characteristic of bonding head is investigated by using finite element method. Modal analysis flows and method are given. Three-dimensional digital model and finite element model of bonding head are established. The dynamic characteristics of constraint static and constraint dynamic are studied using ANSYS Workbench software. The inherent frequencies and vibration modes of the first eight order of bonding head under two kinds of working situations are obtained respectively. Finally, the effectiveness and feasibility of research method is indirectly verified using analogy method. This analysis result provides references for sensors layout in experiment modal analysis and structure topology optimization.