• DocumentCode
    3479831
  • Title

    Advanced Low-Dielectric Constant Packaging Materials With Compatible Conductors

  • Author

    Stein, S.J. ; Wahlers, R.L. ; Sykora, G.

  • Author_Institution
    Electro-Science Laboratories
  • fYear
    1991
  • fDate
    16-18 April 1991
  • Firstpage
    239
  • Lastpage
    243
  • Abstract
    A thick film material, ESL D-4911-S, has been developed which supplies the requisite surface for fine pitch conductors and a low dielectric constant to minimize crosstalk and signal delay. Predictable results were obtained when the D-4911-S was combined with another thick film dielectric to form composite structures. Line resolution of 25 microns or smaller were obtained with ESL D-8084 metallo-organic gold using photoresist/etch processing.
  • Keywords
    Composite materials; Conducting materials; Conductive films; Dielectric constant; Dielectric materials; Dielectric measurements; Dielectric substrates; Gold; Packaging; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electro International, 1991
  • Conference_Location
    New York, NY, USA
  • Type

    conf

  • DOI
    10.1109/ELECTR.1991.718214
  • Filename
    718214
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3479831