MMIC Chips And Modules For EW Systems

The three year Phase 1 MIMIC Program is now in its third year, and very significant progress has been made. The ITT/Martin Marietta Joint Venture, selected as one of the four major Phase I MIMIC teams, is developing chips and modules for demonstration in systern brassboards, including a generic chip set and module for EW Systems. The chip set consists of 23 broadband circuits including amplifiers, mixers, oscillators, switches, variable attenuators, power dividers, power combiners and several special function circuits. A description of the design methodology utilized in developing these chips will be presented including the latest experimental results, a description of representative modules to be assembled and a discussion of the benefits derived from the selected MIMIC insertions.