Novel Polymer Dielectrics for Wafer Level High Density Interconnect

Properties and processability of a new class of thermosetting fluorinated polymer are described. This polymer possesses excellent electrical properties (low dielectric constant and low dielectric loss), optical properties (low absorption and low birefringence), mechanical properties, heat stability, and chemical durability due to its fluorinated rigid backbone and highly crosslinked structure. Both dry-etch and photosensitive formulations are discussed from the viewpoint of reliability and processing requirements for wafer level high density interconnect and packaging such as thin-film formation, adhesion, planarization, stacking and fine patterning capabilities.