DocumentCode :
3479966
Title :
Effect of high temperature thermal aging on microstructural evolution of Sn3Ag0.5Cu/Cu solder joints
Author :
Hailong Li ; Rong An ; Mingliang Fu ; Chunqing Wang ; Mei Zhu ; Rui Zhang
Author_Institution :
State Key Lab. of Adv. Welding & Joining, Harbin Inst. of Technol., Harbin, China
fYear :
2013
fDate :
11-14 Aug. 2013
Firstpage :
772
Lastpage :
776
Abstract :
The solder joints of SAC305/Cu were aged at ultra-high temperature of 210°C, near the melting point of the solder. The growth kinetics of interfacial IMCs follows the diffusion-controlled kinetics. But there are some Cu6Sn5 particles in the solder bulk. With the aging time increasing, the particles can coalesce into long needle-type Cu6Sn5. This is a unique phenomenon different from traditional thermal aging.
Keywords :
ageing; copper alloys; reaction kinetics; reliability; silver alloys; solders; tin alloys; Cu6Sn5; SAC305-Cu; SnAgCu-Cu; aging time; diffusion-controlled kinetics; growth kinetics; high temperature thermal aging; interfacial IMC; long needle-type; microstructural evolution; solder bulk; solder joints; solder melting point; temperature 210 C; Aging; Kinetic theory; Laboratories; Morphology; Reliability; Soldering; Temperature; SAC305; aging; high temperature; needle;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
Type :
conf
DOI :
10.1109/ICEPT.2013.6756579
Filename :
6756579
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3479966
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