• DocumentCode
    3479966
  • Title

    Effect of high temperature thermal aging on microstructural evolution of Sn3Ag0.5Cu/Cu solder joints

  • Author

    Hailong Li ; Rong An ; Mingliang Fu ; Chunqing Wang ; Mei Zhu ; Rui Zhang

  • Author_Institution
    State Key Lab. of Adv. Welding & Joining, Harbin Inst. of Technol., Harbin, China
  • fYear
    2013
  • fDate
    11-14 Aug. 2013
  • Firstpage
    772
  • Lastpage
    776
  • Abstract
    The solder joints of SAC305/Cu were aged at ultra-high temperature of 210°C, near the melting point of the solder. The growth kinetics of interfacial IMCs follows the diffusion-controlled kinetics. But there are some Cu6Sn5 particles in the solder bulk. With the aging time increasing, the particles can coalesce into long needle-type Cu6Sn5. This is a unique phenomenon different from traditional thermal aging.
  • Keywords
    ageing; copper alloys; reaction kinetics; reliability; silver alloys; solders; tin alloys; Cu6Sn5; SAC305-Cu; SnAgCu-Cu; aging time; diffusion-controlled kinetics; growth kinetics; high temperature thermal aging; interfacial IMC; long needle-type; microstructural evolution; solder bulk; solder joints; solder melting point; temperature 210 C; Aging; Kinetic theory; Laboratories; Morphology; Reliability; Soldering; Temperature; SAC305; aging; high temperature; needle;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
  • Conference_Location
    Dalian
  • Type

    conf

  • DOI
    10.1109/ICEPT.2013.6756579
  • Filename
    6756579
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3479966