A study on solder-joints fall-off failure of electroless nickel/immersion gold pad

Author

Wan Zhonghua ; Zou Yabing ; He Guanghui ; Luo Daojun

Author_Institution

Reliability Res. & Anal. Center, China Ceprei Lab., Guangzhou, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

814

Lastpage

817

Abstract

Solder joints which had fell from the electroless nickel/immersion gold (ENIG) pads during the assembly process after reflow were studied in this paper. In order to probe the root cause of the failure in solder joints, cross section and Scanning Electron Microscopy/Energy Dispersive X-ray (SEM&EDS) techniques were applied. In addition, solderability test was also put forward to verify the failure phenomenon. Results showed that, because of the serious corrosion of Ni layer on pad, the interface intermetallic compound (IMC) layer of test samples formed badly, which resulted in the insufficient mechanical strength of solder joints and caused crack or fell off. The Ni-corrosion resulted from poor ENIG process.

Keywords

X-ray chemical analysis; corrosion; electroless deposition; failure analysis; nickel; reflow soldering; scanning electron microscopy; solders; EDS techniques; ENIG pads; Ni; Ni layer; SEM techniques; corrosion; cross section; electroless nickel-immersion gold pads; energy dispersive X-ray techniques; failure phenomenon; interface IMC layer; interface intermetallic compound; mechanical strength; reflow; scanning electron microscopy techniques; solder joints failure; solderability test; Corrosion; Electronics packaging; Gold; Nickel; Soldering; Surface cracks; Surface morphology; Ni-corrosion; electroless nickel/immersion gold (ENIG); solderability test;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756588

Filename

6756588