DocumentCode
3480199
Title
Multiobjective Optimization of Cost, Performance and Thermal Reliability in 3DICs
Author
Kashfi, Fatemeh ; Draper, J.
Author_Institution
Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
fYear
2013
fDate
4-6 Sept. 2013
Firstpage
404
Lastpage
411
Abstract
In this paper we propose a fast and efficient method of multiobjective optimization for 3DIC building block placement. The objectives are cost, performance and thermal reliability. Our proposed method is based on a Quasi-Newton analytical optimization method. Our approach also uses a scalarization method of Compromise Programming, in which the weighted distance of the objectives from their minimum points is optimized. A fast 3DIC thermal map model is used in the optimization algorithm to eliminate the thermal analysis bottleneck during the optimization iterations. In comparison with previous multiobjective optimizations for sample 3DIC configurations, our method reduces the peak temperature by 4.3% and total wire length by 5.7% while it is more than 17x faster in the optimization runtime, on average.
Keywords
circuit optimisation; integrated circuit reliability; three-dimensional integrated circuits; 3DIC; compromise programming; cost; multiobjective optimization; peak temperature; performance; quasiNewton analytical optimization method; scalarization method; thermal reliability; wire length; Equations; Linear programming; Optimization; Reliability; Stacking; Thermal analysis; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Digital System Design (DSD), 2013 Euromicro Conference on
Conference_Location
Los Alamitos, CA
Type
conf
DOI
10.1109/DSD.2013.51
Filename
6628306
Link To Document