• DocumentCode
    3480199
  • Title

    Multiobjective Optimization of Cost, Performance and Thermal Reliability in 3DICs

  • Author

    Kashfi, Fatemeh ; Draper, J.

  • Author_Institution
    Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
  • fYear
    2013
  • fDate
    4-6 Sept. 2013
  • Firstpage
    404
  • Lastpage
    411
  • Abstract
    In this paper we propose a fast and efficient method of multiobjective optimization for 3DIC building block placement. The objectives are cost, performance and thermal reliability. Our proposed method is based on a Quasi-Newton analytical optimization method. Our approach also uses a scalarization method of Compromise Programming, in which the weighted distance of the objectives from their minimum points is optimized. A fast 3DIC thermal map model is used in the optimization algorithm to eliminate the thermal analysis bottleneck during the optimization iterations. In comparison with previous multiobjective optimizations for sample 3DIC configurations, our method reduces the peak temperature by 4.3% and total wire length by 5.7% while it is more than 17x faster in the optimization runtime, on average.
  • Keywords
    circuit optimisation; integrated circuit reliability; three-dimensional integrated circuits; 3DIC; compromise programming; cost; multiobjective optimization; peak temperature; performance; quasiNewton analytical optimization method; scalarization method; thermal reliability; wire length; Equations; Linear programming; Optimization; Reliability; Stacking; Thermal analysis; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Digital System Design (DSD), 2013 Euromicro Conference on
  • Conference_Location
    Los Alamitos, CA
  • Type

    conf

  • DOI
    10.1109/DSD.2013.51
  • Filename
    6628306