Analysis of accelerator consumption in TSV copper electroplating

Accelerator consumption was analyzed by electrochemical method. As the presence of SPS and PEG in the acidic cupric sulfate solution with chloride ions, the cathodic polarization curves become have peaks and valleys. The peak and valley have a strong association with the additive concentration and are associated with the electroplating process. The effect of electroplating time on the cathodic polarization curves is similar to the effect of SPS concentration. The linear relation between parameter Q with the concentration of SPS is Q = 0.007624 + 0.150992C_SPS. The parameter Q is useful for the analysis of SPS consumption in TSV copper electroplating. The real deposition in TSV verifies that SPS consumption in the process of plating can be obtained by analyzing cathodic polarization curves.