Transient electro-thermo-mechanical responses of wire bonding interconnects illuminated by an electromagnetic pulse

In this paper, a hybrid physical simulation method is implemented so as to characterize transient temperature and stress responses in wire bonding interconnects in high-density 3-D ICs under the impact of an EMP. Our self-developed algorithm is based on time-domain FEM, which is capable of handling interactions and coupling among different physical fields. In particular, temperature-dependent nonlinearities of electrical conductivities, thermal conductivities, thermal expansion coefficients, and even the Young´s modulus of all materials involved are treated rigorously.