Effect of temperature on failure mode of solder joint under vibration loading condition

Author

Zhang Hongwu ; Zhao Tianhao ; Liu Yang ; Sun Fenglian

Author_Institution

Sch. of Mater. Sci. & Eng., Harbin Univ. of Sci. & Technol., Harbin, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

853

Lastpage

856

Abstract

In this study, effect of temperature on failure mode of Sn3.0Ag0.5Cu (SAC305) solder joint was studied under vibration loading. Statistical results indicated that crack mainly occurred in IMC /copper pad and IMC/ bulk solder under single vibration loading. The dominant failure mode was crack of IMC. While under temperature-vibration hybrid loading, crack path shifted from IMC to bulk solder. The dominant failure mode was crack within bulk solder and mixed crack of IMC and within bulk solder. Moreover, failure process of crack propagation was digitally featured using self-designed data acquisition system.

Keywords

cracks; dynamic testing; failure analysis; silver alloys; solders; statistical analysis; tin alloys; vibrations; IMC-bulk solder; IMC-copper pad; SnAgCu; crack path; crack propagation; data acquisition system; digital feature; dominant failure mode; solder joint; solder joint reliability; statistical analysis; temperature-vibration hybrid loading; Copper; Data acquisition; Educational institutions; Loading; Reliability; Soldering; Vibrations; digital feature; failure mode; failure process; statistical analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756597

Filename

6756597