Title :
Effect of temperature on failure mode of solder joint under vibration loading condition
Author :
Zhang Hongwu ; Zhao Tianhao ; Liu Yang ; Sun Fenglian
Author_Institution :
Sch. of Mater. Sci. & Eng., Harbin Univ. of Sci. & Technol., Harbin, China
Abstract :
In this study, effect of temperature on failure mode of Sn3.0Ag0.5Cu (SAC305) solder joint was studied under vibration loading. Statistical results indicated that crack mainly occurred in IMC /copper pad and IMC/ bulk solder under single vibration loading. The dominant failure mode was crack of IMC. While under temperature-vibration hybrid loading, crack path shifted from IMC to bulk solder. The dominant failure mode was crack within bulk solder and mixed crack of IMC and within bulk solder. Moreover, failure process of crack propagation was digitally featured using self-designed data acquisition system.
Keywords :
cracks; dynamic testing; failure analysis; silver alloys; solders; statistical analysis; tin alloys; vibrations; IMC-bulk solder; IMC-copper pad; SnAgCu; crack path; crack propagation; data acquisition system; digital feature; dominant failure mode; solder joint; solder joint reliability; statistical analysis; temperature-vibration hybrid loading; Copper; Data acquisition; Educational institutions; Loading; Reliability; Soldering; Vibrations; digital feature; failure mode; failure process; statistical analysis;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756597
