Non-destructive testing for defects in electronic package based on Infrared Thermography

Author

Liu Chengyan ; Qin Fei ; Ban Zhaowei

Author_Institution

Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

865

Lastpage

869

Abstract

Defects such as interfacial delaminations degrade the yield rate and reliability of the device. It´s important to find and evaluate these defects on time. Infrared Thermography is proved to be a valuable tool for non-destructive testing of materials. In this paper the relationship between the thermal characteristics of the sample surface and the defect feature parameters is investigated using Infrared Thermography; while an approach to quantitatively evaluate the defect is proposed.

Keywords

delamination; electronics packaging; infrared imaging; nondestructive testing; reliability; defect feature parameters; defects; device reliability; electronic package; infrared thermography; interfacial delamination; nondestructive material testing; sample surface; thermal characteristics; yield rate; Electronics packaging; Heating; Materials; Sensitivity; Temperature measurement; Temperature sensors; Thermal conductivity; defect detection; electronic package; infrared thermography; non-destructive testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756600

Filename

6756600