Title :
Non-destructive testing for defects in electronic package based on Infrared Thermography
Author :
Liu Chengyan ; Qin Fei ; Ban Zhaowei
Author_Institution :
Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China
Abstract :
Defects such as interfacial delaminations degrade the yield rate and reliability of the device. It´s important to find and evaluate these defects on time. Infrared Thermography is proved to be a valuable tool for non-destructive testing of materials. In this paper the relationship between the thermal characteristics of the sample surface and the defect feature parameters is investigated using Infrared Thermography; while an approach to quantitatively evaluate the defect is proposed.
Keywords :
delamination; electronics packaging; infrared imaging; nondestructive testing; reliability; defect feature parameters; defects; device reliability; electronic package; infrared thermography; interfacial delamination; nondestructive material testing; sample surface; thermal characteristics; yield rate; Electronics packaging; Heating; Materials; Sensitivity; Temperature measurement; Temperature sensors; Thermal conductivity; defect detection; electronic package; infrared thermography; non-destructive testing;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756600
