Title :
The interfacial microstructure and Kirkendall voids in In-48Sn/Cu solder joint
Author :
Fei-Fei Tian ; Zhi-Quan Liu
Author_Institution :
Inst. of Metal Res., Nat. Lab. for Mater. Sci., Shenyang, China
Abstract :
The interfacial microstructure and Kirkendall voids between eutectic SnIn and polycrystalline Cu substrate was investigated after reflowing and long-term solid-state aging process. The results indicated that two crystal-structure IMC species: Cu(In, Sn)2 phase existing at the solder side and Cu2(In, Sn) phase locating at the Cu side, among which Cu2(In, Sn) phase with two different morphologies, the coarse-grained and fine-grained Cu2(In, Sn) sublayers formed at the interface after reflowing. During aging, Cu(In, Sn)2 phase transformed into Cu2(In, Sn). At the interface between coarse- and fine-grained Cu2(In, Sn) sublayers, there exist formed Kirkendall voids after reflowing and solid-state aging, which may degrade the mechanical property of the solder joints.
Keywords :
ageing; copper alloys; crystal structure; indium alloys; reflow soldering; solders; tin alloys; voids (solid); CuIn2; CuSn2; Kirkendall voids; SnIn; coarse-grained sublayer; crystal structure IMC species; fine-grained sublayer; interfacial microstructure; mechanical property; phase transformation; polycrystalline copper substrate; reflowing process; solder joint; solid-state aging process; Aging; Atomic layer deposition; Microstructure; Soldering; Substrates; Tin; In-48Sn solder; Intermetallic compound; Kirkendall voids;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756608
