• DocumentCode
    3480758
  • Title

    Software Product Lines Beyond Software Development

  • Author

    Decker, S.G. ; Dager, J.

  • Author_Institution
    Cummins Inc., Huntsville
  • fYear
    2007
  • fDate
    10-14 Sept. 2007
  • Firstpage
    275
  • Lastpage
    280
  • Abstract
    The impact of software product lines to software development and maintenance costs has been well documented. Reduced time to market and number of people required to develop and support a company´s software products constitute some of these savings. However, the actual savings model is more than just savings within the software development community. In fact, the savings realized directly by the software community may not be the biggest savings in the company. At Cummins Inc., we have realized impacts outside of embedded software development because of the use of software product lines. Service tool development costs for a product within the product line is 10% of those products outside the product line. Other impacts in areas like customer engineering, technician efficiency, calibration development, service engineering, management, and customer satisfaction are often harder to quantify, but these areas reap positive benefits from the product line architecture. This brings more of a business level to product line engineering.
  • Keywords
    DP industry; product development; software development management; software maintenance; software tools; business level; calibration development; customer engineering; customer satisfaction; embedded software development; product line architecture; product line engineering; service engineering; service tool development costs; software maintenance costs; software product lines; technician efficiency; Calibration; Costs; Customer satisfaction; Embedded software; Engineering management; Manufacturing; Programming; Software maintenance; Software tools; Time to market;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Software Product Line Conference, 2007. SPLC 2007. 11th International
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-0-7695-2888-5
  • Type

    conf

  • DOI
    10.1109/SPLINE.2007.16
  • Filename
    4339277