Study of the junction to case thermal resistance test method for IC based on ETM

The junction-to-case thermal resistance is a measure of the ability of a semiconductor device to dissipate heat from the surface of the die to a heat sunk package surface. Learning about the thermal resistance is an important means of making knowledge of the working junction temperature of a device. According to the related thermal resistance test standards, there are two major junction to case thermal resistance test methods based on Electrical Test Method (ETM), one is the traditional thermocouple measurement which requires the determination of the junction temperature and case temperature, the other one is the transient dual interface test method which is solely based on transient measurements of the junction temperature. In this letter, we use two kinds of ETM to measure the thermal characteristics of a device, the package form of which is CPGA391, and then make a full comparison of these two methods from the aspect of measure process and the result.