• DocumentCode
    3481043
  • Title

    Ultra-compact and light weight intelligent power semiconductor module for hybrid system

  • Author

    Gohara, Hiromichi ; Morozumi, Akira ; Ichimura, T. ; Nishimura, Yasutaro ; Higuchi, Kenichi ; Dietrich, Paul ; Nishiura, Akira ; Takahashi, Y.

  • Author_Institution
    Fuji Electr. Co., Ltd., Matsumoto, Japan
  • fYear
    2013
  • fDate
    17-20 Nov. 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Recently, hybrid electric vehicles are required high power with high fuel efficiency and comfortable large cabin space. An ultra compact intelligent power module for two-motor hybrid electric vehicles which integrates one back-boost chopper and an inverter for a traction motor, an inverter for a power generator has been developed. The module is the world´s first released module which has a direct liquid cooling structure with a solder-joined aluminium heat sink. The module achieves a 30-% reduction of volume and a 60-% reduction of weight compared to our conventional models. A heat sink with high cooling capacity and a high-strength solder were newly developed to establish the structure. The module is designed for 700 V/ 400 kVA system and it has an on-chip self protection functions and serial communication interface with a master control unit.
  • Keywords
    aluminium; choppers (circuits); heat sinks; hybrid electric vehicles; invertors; power semiconductor devices; solders; traction motors; Al; apparent power 400 kVA; back-boost chopper; comfortable large cabin space; direct liquid cooling structure; fuel efficiency; high-strength solder; inverter; light weight intelligent power semiconductor module; on-chip self protection functions; power generator; serial communication interface; solder-joined aluminium heat sink; traction motor; two-motor hybrid electric vehicles; ultra-compact power semiconductor module; voltage 700 V; Aluminum; Coolants; Heat sinks; Insulated gate bipolar transistors; Substrates; aluminium heat sink; direct liquid cooling; intelligent power module; solder joining;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electric Vehicle Symposium and Exhibition (EVS27), 2013 World
  • Conference_Location
    Barcelona
  • Type

    conf

  • DOI
    10.1109/EVS.2013.6914994
  • Filename
    6914994