• DocumentCode
    348114
  • Title

    Reclamation of waste mixture of sulfuric acid and hydrogen peroxide used to clean semiconductor wafers

  • Author

    Inagaki, Yasuhito ; Nishizaki, Mitsuhiro

  • Author_Institution
    Tech. Support Center, Sony Corp., Yokohama, Japan
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    267
  • Lastpage
    270
  • Abstract
    The mixture of sulfuric acid and hydrogen peroxide, or the so-called piranha, used to clean semiconductor wafers generally requires considerable water and chemicals to allow it to be discharged as wastewater and sludge. We have developed a new method of converting the waste mixture into concentrated sulfuric acid, decomposing the hydrogen peroxide in the waste mixture and adding a trace of nitric acid. This method allows the waste mixture to be reused and the amount of water and chemicals required for treating the waste to be reduced
  • Keywords
    hydrogen compounds; integrated circuit manufacture; recycling; surface cleaning; H2O2; H2SO4; HNO3; concentrated sulfuric acid; hydrogen peroxide; nitric acid; piranha; semiconductor wafer cleaning; sulphuric acid; waste mixture reclamation; waste mixture reuse; Chemicals; Cleaning; Electronic mail; Flowcharts; Hydrogen; Polymers; Silicon; Surface treatment; Temperature; Wastewater treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-5403-6
  • Type

    conf

  • DOI
    10.1109/ISSM.1999.808787
  • Filename
    808787