DocumentCode :
348114
Title :
Reclamation of waste mixture of sulfuric acid and hydrogen peroxide used to clean semiconductor wafers
Author :
Inagaki, Yasuhito ; Nishizaki, Mitsuhiro
Author_Institution :
Tech. Support Center, Sony Corp., Yokohama, Japan
fYear :
1999
fDate :
1999
Firstpage :
267
Lastpage :
270
Abstract :
The mixture of sulfuric acid and hydrogen peroxide, or the so-called piranha, used to clean semiconductor wafers generally requires considerable water and chemicals to allow it to be discharged as wastewater and sludge. We have developed a new method of converting the waste mixture into concentrated sulfuric acid, decomposing the hydrogen peroxide in the waste mixture and adding a trace of nitric acid. This method allows the waste mixture to be reused and the amount of water and chemicals required for treating the waste to be reduced
Keywords :
hydrogen compounds; integrated circuit manufacture; recycling; surface cleaning; H2O2; H2SO4; HNO3; concentrated sulfuric acid; hydrogen peroxide; nitric acid; piranha; semiconductor wafer cleaning; sulphuric acid; waste mixture reclamation; waste mixture reuse; Chemicals; Cleaning; Electronic mail; Flowcharts; Hydrogen; Polymers; Silicon; Surface treatment; Temperature; Wastewater treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location :
Santa Clara, CA
ISSN :
1523-553X
Print_ISBN :
0-7803-5403-6
Type :
conf
DOI :
10.1109/ISSM.1999.808787
Filename :
808787
Link To Document :
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