DocumentCode
348114
Title
Reclamation of waste mixture of sulfuric acid and hydrogen peroxide used to clean semiconductor wafers
Author
Inagaki, Yasuhito ; Nishizaki, Mitsuhiro
Author_Institution
Tech. Support Center, Sony Corp., Yokohama, Japan
fYear
1999
fDate
1999
Firstpage
267
Lastpage
270
Abstract
The mixture of sulfuric acid and hydrogen peroxide, or the so-called piranha, used to clean semiconductor wafers generally requires considerable water and chemicals to allow it to be discharged as wastewater and sludge. We have developed a new method of converting the waste mixture into concentrated sulfuric acid, decomposing the hydrogen peroxide in the waste mixture and adding a trace of nitric acid. This method allows the waste mixture to be reused and the amount of water and chemicals required for treating the waste to be reduced
Keywords
hydrogen compounds; integrated circuit manufacture; recycling; surface cleaning; H2O2; H2SO4; HNO3; concentrated sulfuric acid; hydrogen peroxide; nitric acid; piranha; semiconductor wafer cleaning; sulphuric acid; waste mixture reclamation; waste mixture reuse; Chemicals; Cleaning; Electronic mail; Flowcharts; Hydrogen; Polymers; Silicon; Surface treatment; Temperature; Wastewater treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1523-553X
Print_ISBN
0-7803-5403-6
Type
conf
DOI
10.1109/ISSM.1999.808787
Filename
808787
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