DocumentCode
3481345
Title
Medium and atmospheric pressure plasma treatment for improvement of adhesion of PDMS used for flexible and stretchable electronics
Author
De Geyter, N. ; Morent, R. ; Axisa, F. ; De Smet, N. ; Gengembre, L. ; De Leersnijder, E. ; Leys, C. ; Vanfleteren, J. ; Rymarczyk-Machal, M. ; Schacht, E. ; Payen, E.
Author_Institution
Dept. of Appl. Phys., Ghent Univ., Ghent
fYear
2008
fDate
17-20 Aug. 2008
Firstpage
1
Lastpage
3
Abstract
Stretchable electronics consist of a stretchable substrate material with embedded electronic components connected by electronic interconnections. Since little or no stretchable electronic components are available, it is vital to engineer electronic interconnections which are stretchable. Today metals (copper, nickel and gold) are the best option to realize the interconnections with high performance and low cost. However, metals are not intrinsically stretchable, therefore, a suitable design such as a meander-shaped horseshoe structure is necessary. This structure can be reproducibly stretched and released many times without breaking. Among the identified stretchable substrate materials appropriate for the fabrication of implantable electronic systems, polydimethylsiloxane (PDMS) is one of the most promising due to its specific mechanical properties (compliance, softness) and its good biocompatibility.
Keywords
adhesion; flexible electronics; integrated circuit interconnections; plasma materials processing; PDMS adhesion; atmospheric pressure plasma treatment; electronic interconnections; embedded electronic components; flexible and stretchable electronics; implantable electronic systems; meander-shaped horseshoe structure; polydimethylsiloxane; stretchable electronics; stretchable substrate material; Adhesives; Atmospheric-pressure plasmas; Biological materials; Copper; Costs; Electronic components; Fabrication; Gold; Nickel; Plasma materials processing;
fLanguage
English
Publisher
ieee
Conference_Titel
Portable Information Devices, 2008 and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. PORTABLE-POLYTRONIC 2008. 2nd IEEE International Interdisciplinary Conference on
Conference_Location
Garmish-Partenkirchen
Print_ISBN
978-1-4244-2141-1
Electronic_ISBN
978-1-4244-2142-8
Type
conf
DOI
10.1109/PORTABLE-POLYTRONIC.2008.4681279
Filename
4681279
Link To Document