Transverse cracking in viscoelastic bounded assembles

Author

Ingman, D. ; Suzdalnitsky, J.

fYear

2008

fDate

17-20 Aug. 2008

Firstpage

1

Lastpage

16

Abstract

A problem of crack stability in assembles of bi-layers, with a viscoelastic bonding interface is analyzed. Two approaches are used to describe the phenomena: classical fracture mechanics and viscoelastic partial derivative operator. The impact of the viscoelasticity on the stress intensity factor is evaluated for various structural physical and geometric parameters. The crack state for both upper and lower assembly layers, one metallic and the other viscoelastic, is considered.

Keywords

cracks; fracture mechanics; viscoelasticity; classical fracture mechanics; crack stability; geometric parameters; stress intensity factor; transverse cracking; viscoelastic bonding interface; viscoelastic bounded assembles; viscoelastic partial derivative operator; Assembly; Elasticity; Plastics; Semiconductor device packaging; Semiconductor materials; Soldering; Strips; Substrates; Thermal stresses; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Portable Information Devices, 2008 and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. PORTABLE-POLYTRONIC 2008. 2nd IEEE International Interdisciplinary Conference on

Conference_Location

Garmish-Partenkirchen

Print_ISBN

978-1-4244-2141-1

Electronic_ISBN

978-1-4244-2142-8

Type

conf

DOI

10.1109/PORTABLE-POLYTRONIC.2008.4681285

Filename

4681285