Reliability research on optoelectronics packaging

Optoelectronic packaging is a challenge for optoelectronic device and optoelectronic integration. In the packaging level, optical under fill compound, optical fiber array, micro lens, silicon carrier and substrate effects on the thermal, optical and reliability performance of optoelectronic packaging. To prepare this challenge, a wide range of analysis and expertise for integrated optoelectronics, thermal and power management should be done. In this paper, reliability quality is researched based on parallel optical transceiver SiP. Then glue including under fill compound, optical fiber fixed and wire bonding glue is tested under 85 ° C/85 RH and -40 to 85° C thermal shock conformed with TELCORDIA standard. Also dielectric constant is measured for high frequency application. A 8 channel transceiver is fabricated with 80Gbps two way bandwidth. The eye diagram of 10Gbps of transceiver is tested from 25 to 60° C. Some results are discussed and some suggestion given is helpful on design of the reliability of optoelectronic packaging.