In-situ reduced silver nanoparticles for highly conductive anisotropic conductive films applications

Highly conductive anisotropic conductive films (ACFs) with in-situ reduced silver nanoparticles as fillers were developed. During the preparation of ACF formulation, the silver nanoparticles were reduced by the hydroxyl groups from the phenoxy resin through the polyol process. Due to the capping effects of the epoxy resin, the in-situ reduced silver nanoparticles were well dispersed in the polymer matrix with uniform size distribution. The uniform silver nanoparticles provided better contact between metal pads of the chips and substrates, resulting in the production of a highly conductive ACF joint.