Synthesis of Ag nanorods and application to soft die attaching

Author

Jiu, Jinting ; Murai, Keiichi ; Kim, Keunsoo ; Suganuma, Katsuaki

Author_Institution

Inst. of Sci. & Ind. Res., Osaka Univ., Ibaraki

fYear

2008

fDate

17-20 Aug. 2008

Firstpage

1

Lastpage

5

Abstract

In this paper, we report the synthesis of Ag nanoparticles paste, a new bonding agent using between chips and substrates in semiconductor devices. Ag nanorods with varied yield have been successfully synthesized by simply adjusting the concentration of additive salt, the moral ratio of capping agent to AgNO₃. The Ag nanoparticles can be sintered to form porous die attach layer between chip and substrates. The performance of Ag die attach layer has been discussed by electrical conductibility, and strength measurements.

Keywords

integrated circuit bonding; nanoparticles; silver compounds; substrates; additive salt; bonding agent; die attach layer; electrical conductibility; nanoparticles; nanorods; semiconductor devices; soft die attaching; strength measurements; Additives; Bonding; Electric variables measurement; Ethics; Joining processes; Microassembly; Nanoparticles; Semiconductor device measurement; Semiconductor devices; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Portable Information Devices, 2008 and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. PORTABLE-POLYTRONIC 2008. 2nd IEEE International Interdisciplinary Conference on

Conference_Location

Garmish-Partenkirchen

Print_ISBN

978-1-4244-2141-1

Electronic_ISBN

978-1-4244-2142-8

Type

conf

DOI

10.1109/PORTABLE-POLYTRONIC.2008.4681287

Filename

4681287