Title :
The bonding of LiNbO3-silicon via BCB material
Author :
Jin Cheng ; Weiguo Liu ; Huan Liu
Author_Institution :
Micro-Optoelectron. Syst. Labs., Xi´´an Technol. Univ., Xi´´an, China
fDate :
Aug. 29 2012-Sept. 1 2012
Abstract :
Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding (e.g. glass, polymers, resists, polyimides). This paper presents results on adhesive bonding using spin-on Benzocyclobutene(BCB) from Dow Chemicals. The advantages of using adhesive bonding for MEMS applications will be illustrated by presenting a technology of fabricating LiNbO3-on-Si substrates. By changing the rotational speed of spin coating and BCB thickness, bonding temperature, hold temperature, bonding pressure, and other parameters, we carried out a series of process optimization experiment. Finally the bonding shear strength was tested. The results show that LiNbO3 and silicon has a good bonding strength under the bonding conditions at 200°C. This process will allow us the hybrid integrated manufacturing of SAW devices.
Keywords :
adhesive bonding; elemental semiconductors; lithium compounds; mechanical testing; shear strength; silicon; spin coating; wafer bonding; BCB material; BCB thickness; LiNbO3-Si; LiNbO3-on-Si substrates; MEMS applications; SAW devices; adhesive wafer bonding; bonding pressure; bonding shear strength; bonding temperature; hold temperature; hybrid integrated manufacturing; intermediate layer; optimization; rotational speed; spin coating; spin-on benzocyclobutene; temperature 200 degC; Bonding; Curing; Heating; Qualifications; Silicon; Surface acoustic wave devices; BCB; LiNbO3; Silicon; bonding;
Conference_Titel :
Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 2012 International Conference on
Conference_Location :
Shaanxi
Print_ISBN :
978-1-4673-4588-0
Electronic_ISBN :
978-1-4673-4589-7
DOI :
10.1109/3M-NANO.2012.6472990
