• DocumentCode
    348175
  • Title

    Influence of a shallow p+ offset region on a novel edge termination technique using lightly doped p-rings

  • Author

    Bose, J.V.S.C. ; De Souza, M.M. ; Narayanan, E. M Sankara ; Spulber, O. ; Sweet, M.

  • Author_Institution
    Emerging Technol. Res. Centre, De Montfort Univ., Leicester, UK
  • Volume
    1
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    63
  • Abstract
    In this paper, for the first time, a novel `volumetric´ edge termination structure using minimally sized lightly doped p-rings is presented. The addition of a shallow p+ region, offset from the centre of each well towards the main junction, reduces the peak electric field at the surface and provides immunity to interface oxide charges. An alternative structure with metal field plate contacted to a p region centred within the p-well enables the peak electric field at each ring to be further reduced. As a result 90% of the plane parallel breakdown voltage can be achieved by increasing the number of rings. The influence of oxide thickness and the interface charge on the breakdown voltage of all three edge terminations has been analysed in detail
  • Keywords
    doping profiles; insulated gate bipolar transistors; isolation technology; power bipolar transistors; power semiconductor switches; semiconductor device breakdown; edge termination technique; floating ring structure; interface oxide charge immunity; lightly doped p-rings; metal field plate; oxide thickness effect; planar IGBT; plane parallel breakdown voltage; power semiconductor devices; reduced peak electric field; shallow p+ offset region; volumetric structure; Breakdown voltage; Buildings; Costs; Doping profiles; Immunity testing; Insulated gate bipolar transistors; Passivation; Programmable control; Termination of employment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference, 1999. CAS '99 Proceedings. 1999 International
  • Conference_Location
    Sinaia
  • Print_ISBN
    0-7803-5139-8
  • Type

    conf

  • DOI
    10.1109/SMICND.1999.810389
  • Filename
    810389