DocumentCode :
3481753
Title :
Construction analysis for inherent reliability evaluation of surface acoustic wave filters
Author :
Hong-Zhi Liu ; Xin Liu ; Yun-fei En ; Yun Huang ; Ping Lai
Author_Institution :
Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., China Electron. Product Reliability & Environ. Testing Res. Inst., Guangzhou, China
fYear :
2013
fDate :
11-14 Aug. 2013
Firstpage :
1118
Lastpage :
1121
Abstract :
Inherent reliability of Surface acoustic wave filters plays a key role for its application in the mobile communication systems. Construction analysis is an effective method for evaluating the inherent reliability of electronic components. This work provides a construction analysis process for the surface acoustic wave filters, which includes external encapsulation analysis, internal encapsulation analysis and chip-level analysis. The results show that oxidation occurs on the upper surface of the Al electrodes and leads to the formation of Al2O3. The break in the Al electrode stripe is observed.
Keywords :
aluminium; aluminium compounds; reliability; surface acoustic wave filters; aluminium electrode stripe; chip-level analysis; construction analysis process; electronic components; external encapsulation analysis; inherent reliability evaluation; internal encapsulation analysis; mobile communication systems; oxidation; surface acoustic wave filters; Acoustic waves; Electrodes; Encapsulation; Reliability; SAW filters; Substrates; Surface acoustic wave devices; Surface acoustic wave filters; construction analysis; inherent reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
Type :
conf
DOI :
10.1109/ICEPT.2013.6756654
Filename :
6756654
Link To Document :
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