Construction analysis for inherent reliability evaluation of surface acoustic wave filters

Author

Hong-Zhi Liu ; Xin Liu ; Yun-fei En ; Yun Huang ; Ping Lai

Author_Institution

Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., China Electron. Product Reliability & Environ. Testing Res. Inst., Guangzhou, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

1118

Lastpage

1121

Abstract

Inherent reliability of Surface acoustic wave filters plays a key role for its application in the mobile communication systems. Construction analysis is an effective method for evaluating the inherent reliability of electronic components. This work provides a construction analysis process for the surface acoustic wave filters, which includes external encapsulation analysis, internal encapsulation analysis and chip-level analysis. The results show that oxidation occurs on the upper surface of the Al electrodes and leads to the formation of Al₂O₃. The break in the Al electrode stripe is observed.

Keywords

aluminium; aluminium compounds; reliability; surface acoustic wave filters; aluminium electrode stripe; chip-level analysis; construction analysis process; electronic components; external encapsulation analysis; inherent reliability evaluation; internal encapsulation analysis; mobile communication systems; oxidation; surface acoustic wave filters; Acoustic waves; Electrodes; Encapsulation; Reliability; SAW filters; Substrates; Surface acoustic wave devices; Surface acoustic wave filters; construction analysis; inherent reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756654

Filename

6756654