• DocumentCode
    3481764
  • Title

    Room temperature sintering of ag nano-scale particles with drying of the solvent

  • Author

    Wakuda, Daisuke ; Kim, Keun-Soo ; Suganuma, Katsuaki

  • Author_Institution
    Japan Soc. for the Promotion of Sci.
  • fYear
    2008
  • fDate
    17-20 Aug. 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    We successfully developed a new Ag nanoparticle paste which can sinter at room temperature simply by drying solvent of the paste. Very small amount of alkylamine was incorporated into the Ag nanoparticles paste to protect the nanoparticles. By drying at room temperature, Ag nanoparticles are sintered resulting in low resistivity of 4.9times10-6 Omegam. Necking and coalescence of Ag nanoparticles occur only for a few minutes after drying the solvent. At room temperature, grain of Ag nanoparticles grows gradually for a few days. Heat treatment of the paste can reduce the resistivity effectively. The Ag nanoparticle paste was printed on glass substrates and was heated at 50degC, 100degC and 150degC for various times, respectively. Sintering of nanoparticles was promoted by this heat-treatment. It was observed that Ag nanoparticles grow by absorbing smaller nanoparticles during sintering. By this sintering mechanism, nanoparticles can grow much bigger than uniform sintering mechanism. Since the new paste can be sintered even at room temperature without heat treatment, the paste can expand the versatility of its applications for electronics wiring.
  • Keywords
    drying; heat treatment; nanoparticles; silver; sintering; Ag; drying; glass substrates; heat treatment; nanoparticle paste; room temperature sintering; Adaptive systems; Conductivity; Glass; Heat treatment; Inorganic materials; Nanoparticles; Protection; Solvents; Temperature; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Portable Information Devices, 2008 and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. PORTABLE-POLYTRONIC 2008. 2nd IEEE International Interdisciplinary Conference on
  • Conference_Location
    Garmish-Partenkirchen
  • Print_ISBN
    978-1-4244-2141-1
  • Electronic_ISBN
    978-1-4244-2142-8
  • Type

    conf

  • DOI
    10.1109/PORTABLE-POLYTRONIC.2008.4681302
  • Filename
    4681302