The effects of humidity and temperature aging test on flexible packaging LED module

LEDs are replacing incandescent bulbs in many fields particularly those requiring durability and low power consumption. The flexible packaged LED module could apply Surface light source, it is very useful in some special occasion. In some of these applications, as automotive and outside of the buildings, flexible packaged LEDs modules were exposed in extreme temperature and humidity conditions. In this paper, one thermal aging test and three thermal humidity aging tests were designed to investigate the reliability of flexible packaged LED modules. Main failure modes and mechanisms have been identified for the different aging test. Peck model was use to predict the degradation time of the LED modules.