• DocumentCode
    3482525
  • Title

    Propagation of stress wave in nickel single crystals nanofilm via molecular dynamics

  • Author

    Jia, Yan ; Liu, Heng ; Yu, Lie

  • Author_Institution
    Inst. of Mechatron. & Inf. Syst., Xi´´an Jiaotong Univ., Xi´´an, China
  • fYear
    2009
  • fDate
    5-7 Aug. 2009
  • Firstpage
    1396
  • Lastpage
    1400
  • Abstract
    Stress wave propagation is examined in nickel single crystals nano-film using molecular dynamics. The x, y and z direction correspond to the crystallographic orientation [100], [011] and [0-11], respectively. Two kind of shear stress is loaded along x-axis, which is also loaded along z-axis. One is the 0.36 Gpa square pulse shear stress, which can be maintained 1 ps, and the other is the 0.36 Gpa constant shear stress. The simulation result shows that the stress transfer in the metal film is according to the way of wave, and there is time lag in the progress of stress wave propagation. The properties of wave reflected from fixed and free end are different. The stress reversal is a characteristic of the free end, and the stress multiplication phenomenon is a characteristic of the fixed end. The wave speed is different, as the stress wave propagates along the different lattice direction. This is consistent with the macroscopic conclusion.
  • Keywords
    crystal orientation; elastic waves; internal stresses; metallic thin films; molecular dynamics method; nanostructured materials; nickel; Ni; crystallographic orientation; metal film; molecular dynamics; nanofilm; nickel single crystals; shear stress; stress multiplication phenomenon; stress reversal; stress wave propagation; Computer simulation; Crystalline materials; Crystallography; Crystals; Grain boundaries; Lattices; Manufacturing; Nickel; Shock waves; Stress; molecular dynamics; nanofilm; stress wave;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Automation and Logistics, 2009. ICAL '09. IEEE International Conference on
  • Conference_Location
    Shenyang
  • Print_ISBN
    978-1-4244-4794-7
  • Electronic_ISBN
    978-1-4244-4795-4
  • Type

    conf

  • DOI
    10.1109/ICAL.2009.5262755
  • Filename
    5262755