• DocumentCode
    3482581
  • Title

    Simulation model and it´s sharp tuning for SiO2 thin film transmission line

  • Author

    Wenbin Chen ; Xianmin Huang ; Xiaosong Ma ; Miao Cai ; Daoguo Yang

  • Author_Institution
    Guilin Univ. of Electron. Technol., Guilin, China
  • fYear
    2013
  • fDate
    11-14 Aug. 2013
  • Firstpage
    1284
  • Lastpage
    1287
  • Abstract
    This paper aims to build an simulation model for SiO2 thin film coplanar waveguide transmission line. After sharp tuning the model´s parameters, an optimization simulation model has been found. The S-parameters will be presented through wafer-probe measurements and EM simulation (electromagnetic simulation). In order to get the better fit between measurements data and simulations, parameters such as the conduct width are tuned. In view of the results, the most appropriate parameters will be found and an optimization simulation model of the test structure will be presented. The optimization simulation model has been defined as CPW transmission line with a known SiO2 layer which using ADS (Advanced Design System 2012.08) simulations and two ports S-parameters measurements up to 6 GHz. The result proves that this model is suitable for characterization of the new dielectric materials by experimental validation.
  • Keywords
    coplanar transmission lines; coplanar waveguides; optimisation; thin film devices; tuning; ADS; CPW transmission line; EM simulation; S-parameters measurements; SiO2; advanced design system; dielectric materials; electromagnetic simulation; optimization simulation model; sharp tuning; simulation model; thin film coplanar waveguide transmission line; thin film transmission line; wafer-probe measurements; Data models; Gold; Market research; Scattering parameters; Semiconductor device modeling; Transmission line measurements; Tuning; EM-simulation; S-parameters; SiO2; sharp tuning; thin film;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
  • Conference_Location
    Dalian
  • Type

    conf

  • DOI
    10.1109/ICEPT.2013.6756692
  • Filename
    6756692