• DocumentCode
    3482600
  • Title

    Modeling of a MEMS-based display device with electric-mechanical coupling

  • Author

    Fang Wenxiao ; Huang Qinwen

  • Author_Institution
    Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., CEPREI, Guangzhou, China
  • fYear
    2013
  • fDate
    11-14 Aug. 2013
  • Firstpage
    1288
  • Lastpage
    1291
  • Abstract
    MEMS-based display with interferometric modulation (IMOD) is a new technology breakthrough that shows substantial performance, such as a significant reduction in power consumption, extending device battery life, no backlighting. The display consists of a suspended conductive membrane serving as a mirror over a partially reflective optical stack. In this paper, the mechanical response and the electrostatic interaction between the membrane and the substrate are studied, taking the mechanical-electrostatic coupling into account. The parameters of the model are abstracted from observation of the real structure, and can provide useful information for the engineer to improve the design on the structure reliability. It shows that the thickness of the membrane plays a key role for the deflection when subjecting to an electric voltage. The simulation could provide useful information for the engineer to improve the design on the structure reliability.
  • Keywords
    electrostatic devices; micromechanical devices; power consumption; secondary cells; IMOD; MEMS-based display device; device battery life; electric voltage; electric-mechanical coupling; electrostatic interaction; interferometric modulation; mechanical-electrostatic coupling; partially reflective optical stack; power consumption; suspended conductive membrane; Couplings; Electrostatics; Finite element analysis; Force; Image color analysis; Micromechanical devices; Reliability; MEMS-based display; Modling; mechanical-electrostatic coupling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
  • Conference_Location
    Dalian
  • Type

    conf

  • DOI
    10.1109/ICEPT.2013.6756693
  • Filename
    6756693