DocumentCode
348311
Title
Hybrid integration of polymers and semiconductors for photonic integrated circuits
Author
Dagli, N.
Author_Institution
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
Volume
2
fYear
1999
fDate
Aug. 30 1999-Sept. 3 1999
Firstpage
258
Abstract
We combine polymers and semiconductors for application to high-performance photonic integrated circuits (PICs). We apply well-established semiconductor processing techniques to fabricate structures such as waveguides, gratings, pn junctions, and quantum wells. Then we use polymers to bond these samples to transfer substrates. Finally we etch away the growth substrate. With further processing we integrate the semiconductor circuit in the remaining epilayer with polymer waveguides. The end product is a photonic chip containing semiconductor only in the regions where there is an optical wave. The rest is made out of low-loss low-cost polymers containing low-loss optical guides which are almost identical to optical fibers. This technology is applied to high speed traveling wave modulators and tunable grating reflectors.
Keywords
electro-optical modulation; hybrid integrated circuits; integrated optics; integrated optoelectronics; optical losses; optical polymers; semiconductor technology; etching; gratings; high speed traveling wave modulators; hybrid integration; low-loss low-cost polymers; low-loss optical guides; photonic chip; photonic integrated circuits; pn junctions; polymer waveguides; polymers; quantum wells; semiconductor processing techniques; semiconductors; transfer substrate bonding; tunable grating reflectors; waveguides; Bonding; Gratings; High speed optical techniques; Optical modulation; Optical polymers; Optical waveguides; Photonic integrated circuits; Semiconductor waveguides; Substrates; Waveguide junctions;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics, 1999. CLEO/Pacific Rim '99. The Pacific Rim Conference on
Conference_Location
Seoul, South Korea
Print_ISBN
0-7803-5661-6
Type
conf
DOI
10.1109/CLEOPR.1999.811402
Filename
811402
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