Title :
Hybrid integration of polymers and semiconductors for photonic integrated circuits
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
fDate :
Aug. 30 1999-Sept. 3 1999
Abstract :
We combine polymers and semiconductors for application to high-performance photonic integrated circuits (PICs). We apply well-established semiconductor processing techniques to fabricate structures such as waveguides, gratings, pn junctions, and quantum wells. Then we use polymers to bond these samples to transfer substrates. Finally we etch away the growth substrate. With further processing we integrate the semiconductor circuit in the remaining epilayer with polymer waveguides. The end product is a photonic chip containing semiconductor only in the regions where there is an optical wave. The rest is made out of low-loss low-cost polymers containing low-loss optical guides which are almost identical to optical fibers. This technology is applied to high speed traveling wave modulators and tunable grating reflectors.
Keywords :
electro-optical modulation; hybrid integrated circuits; integrated optics; integrated optoelectronics; optical losses; optical polymers; semiconductor technology; etching; gratings; high speed traveling wave modulators; hybrid integration; low-loss low-cost polymers; low-loss optical guides; photonic chip; photonic integrated circuits; pn junctions; polymer waveguides; polymers; quantum wells; semiconductor processing techniques; semiconductors; transfer substrate bonding; tunable grating reflectors; waveguides; Bonding; Gratings; High speed optical techniques; Optical modulation; Optical polymers; Optical waveguides; Photonic integrated circuits; Semiconductor waveguides; Substrates; Waveguide junctions;
Conference_Titel :
Lasers and Electro-Optics, 1999. CLEO/Pacific Rim '99. The Pacific Rim Conference on
Conference_Location :
Seoul, South Korea
Print_ISBN :
0-7803-5661-6
DOI :
10.1109/CLEOPR.1999.811402