Increased throughput Using lossy material slabs in a stacked microstrip connector for 10Gbps baseband signaling

Author

Atkinson, Prescott B. ; Gailus, Mark W. ; Sivaprasad, Kondagunta U.

Author_Institution

Dept. of Electr. Eng., Univ. of New Hampshire, Durham, NH

fYear

2008

fDate

16-20 Dec. 2008

Firstpage

1

Lastpage

4

Abstract

In the present study, compared with a baseline case using only low loss air dielectric, the efficacy of six lossy materials in reducing worst-case crosstalk for signal data up to 10 Gbps is evaluated on a simplified connector structure. The connector structure consists of a triple stack up of 5 signal conductor microstrips plus a ground cover for a total of 15 microstrip transmission lines. All lossy materials from this study provide a measurable improvement in SNR, to varying degrees, when tested in this specific shared return conductor microstrip connector structure.

Keywords

absorbing media; microstrip lines; microwave materials; multiconductor transmission lines; baseband signaling; bit rate 10 Gbit/s; crosstalk; lossy material slabs; microstrip transmission lines; stacked microstrip connector; Baseband; Conducting materials; Connectors; Crosstalk; Dielectric losses; Dielectric materials; Microstrip; Slabs; Throughput; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2008. APMC 2008. Asia-Pacific

Conference_Location

Macau

Print_ISBN

978-1-4244-2641-6

Electronic_ISBN

978-1-4244-2642-3

Type

conf

DOI

10.1109/APMC.2008.4958126

Filename

4958126