• DocumentCode
    3484075
  • Title

    Understanding implant damage by implant channeling profile measurements

  • Author

    Packan, P. ; Kenne, H. ; Thompson, S. ; Corcoran, S. ; Taylor, M.

  • Author_Institution
    Intel Corp., Hillsboro, OR, USA
  • fYear
    1996
  • fDate
    16-21 Jun 1996
  • Firstpage
    539
  • Lastpage
    542
  • Abstract
    This study qualitatively measures the damage created during ion implantation by monitoring the amount of channeling which occurs during a subsequent boron implant. The effects of implant dose, energy and beam current on damage generation are presented. In addition, the effects of implant species on damage creation is shown. These effects are qualitatively modeled using dechanneling calculations based on local damage densities. It is shown for the first time that IV recombination of the initial damage cascade generated by ion implantation occurs at temperatures as low as 400°C and for times as short as 5 sec
  • Keywords
    boron; channelling; elemental semiconductors; ion implantation; silicon; 400 C; Si:B; channeling profile measurement; damage cascade; dechanneling; impurity vacancy recombination; ion implantation; Boron; Crystallization; Implants; Ion implantation; Lattices; Monitoring; Nuclear power generation; Silicon; Tail; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology. Proceedings of the 11th International Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-3289-X
  • Type

    conf

  • DOI
    10.1109/IIT.1996.586436
  • Filename
    586436