• DocumentCode
    3484245
  • Title

    SIPOS-passivation for high voltage power devices with planar junction termination

  • Author

    Stockmeier, T. ; Lilja, K.

  • Author_Institution
    ABB Asea Brown Boveri Corp. Res., Baden, Switzerland
  • fYear
    1991
  • fDate
    22-24 Apr 1991
  • Firstpage
    145
  • Lastpage
    148
  • Abstract
    Power diodes have been fabricated with a planar junction termination suitable for breakdown voltages up to 6.2 kV. The devices were passivated with a double layer of SIPOS (semi-insulating polycrystalline silicon) and silicon nitride, directly deposited on the silicon surface. The influence of the SIPOS layer on the current distribution in the device while in the blocking state was investigated by numerical simulation and experimentally. It was found that SIPOS acts simply as a resistive layer and that the portion of the reverse current which flows through the passivation layer is given by the balance of the resistances of the space charge region and the SIPOS layer. Therefore, if the resistance of the SIPOS layer is adjusted carefully (by its oxygen content and its lateral and vertical dimensions), high voltage diodes can be passivated with a semi-insulating material, and an excellent blocking behavior can be achieved
  • Keywords
    electric breakdown of solids; passivation; power electronics; semiconductor diodes; space-charge-limited conduction; SIPOS; Si; Si-Si3N4; blocking state; breakdown voltages; current distribution; high voltage diodes; high voltage power devices; planar junction termination; resistive layer; semi-insulating polycrystalline silicon; space charge region; Conductivity; Current distribution; Diodes; Insulation; Low voltage; Numerical simulation; Passivation; Semiconductor materials; Silicon; Space charge;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs, 1991. ISPSD '91., Proceedings of the 3rd International Symposium on
  • Conference_Location
    Baltimore, MD
  • ISSN
    1063-6854
  • Print_ISBN
    0-7803-0009-2
  • Type

    conf

  • DOI
    10.1109/ISPSD.1991.146086
  • Filename
    146086