DocumentCode
3484575
Title
Teaming for the future with Purdue´s science bound initiative: a cooperative program involving university, secondary schools, and local industries to increase diversity in engineering and technology programs
Author
Campbell, Wesley ; Hylton, Pete
Author_Institution
Dept. of Mech. Eng. Technol., Purdue Univ., West Lafayette, IN
fYear
2005
fDate
19-22 Oct. 2005
Lastpage
13
Abstract
The need to attract more minority students to science, engineering and technology programs is well documented. Purdue University is three years into a program aimed at finding such students while they are still in middle school and keeping them involved through high school and into college. The Purdue science bound program is conducted in cooperation with the Indianapolis Public Schools system and a wide spectrum of industry partners. This partnership is showing evidence of making a significant difference in the way students from an urban environment look at their futures. This paper discusses the partnership among Purdue, the Indianapolis school system, and the Indianapolis business community that makes science bound possible. It also looks at some of the approaches that have proven successful in helping students improve their understanding of concepts that will help them graduate and transition into their chosen careers
Keywords
educational institutions; engineering education; organisational aspects; Indianapolis Public Schools system; Indianapolis business community; Purdue University; Purdue science bound program; engineering programs; local industries; middle school; secondary schools; technology programs; Demography; Educational institutions; Educational technology; Engineering education; Engineering profession; Engineering students; Mechanical engineering; Outsourcing; Recruitment; Scholarships; K-12 engineering programs; Minorities in engineering; Partnerships with industry; Summer enrichment programs;
fLanguage
English
Publisher
ieee
Conference_Titel
Frontiers in Education, 2005. FIE '05. Proceedings 35th Annual Conference
Conference_Location
Indianopolis, IN
ISSN
0190-5848
Print_ISBN
0-7803-9077-6
Type
conf
DOI
10.1109/FIE.2005.1612197
Filename
1612197
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