• DocumentCode
    3484772
  • Title

    Multilayer 180° hybrid in LTCC

  • Author

    Shen, Tze-Ming ; Huang, Ting-Yi ; Wu, Ruey-Beei

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei
  • fYear
    2008
  • fDate
    16-20 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper proposes a multilayer 180deg hybrid using low-temperature co-fired ceramic technology. With the multilayer capability, the hybrid is reconfigured to locate two output ports at the same side. The proposed hybrid is more convenient for connecting other components. Besides, the circuit has 32% size reduction in comparison with the conventional hybrid ring.
  • Keywords
    ceramic packaging; printed circuits; LTCC; low-temperature co-fired ceramic technology; multilayer hybrid; Bandwidth; Ceramics; Circuit simulation; Coupling circuits; Dielectric substrates; Frequency; Joining processes; Microstrip; Nonhomogeneous media; Stripline;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2008. APMC 2008. Asia-Pacific
  • Conference_Location
    Macau
  • Print_ISBN
    978-1-4244-2641-6
  • Electronic_ISBN
    978-1-4244-2642-3
  • Type

    conf

  • DOI
    10.1109/APMC.2008.4958203
  • Filename
    4958203
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3484772