Title :
Multilayer 180° hybrid in LTCC
Author :
Shen, Tze-Ming ; Huang, Ting-Yi ; Wu, Ruey-Beei
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei
Abstract :
This paper proposes a multilayer 180deg hybrid using low-temperature co-fired ceramic technology. With the multilayer capability, the hybrid is reconfigured to locate two output ports at the same side. The proposed hybrid is more convenient for connecting other components. Besides, the circuit has 32% size reduction in comparison with the conventional hybrid ring.
Keywords :
ceramic packaging; printed circuits; LTCC; low-temperature co-fired ceramic technology; multilayer hybrid; Bandwidth; Ceramics; Circuit simulation; Coupling circuits; Dielectric substrates; Frequency; Joining processes; Microstrip; Nonhomogeneous media; Stripline;
Conference_Titel :
Microwave Conference, 2008. APMC 2008. Asia-Pacific
Conference_Location :
Macau
Print_ISBN :
978-1-4244-2641-6
Electronic_ISBN :
978-1-4244-2642-3
DOI :
10.1109/APMC.2008.4958203
