Miniaturized microstrip power divider using an improved substrate integrated artificial dielectric structure

An improved SIAD structure for planar microstrip circuits´ miniaturization has been presented in this paper. This structure provides enhancement of both the permittivity and the permeability, and therefore achieves guided wavelength compression, leading to circuit size miniaturization. By proper design of the SIAD, power divider can exhibit an area reduction of 74%. By change the SIAD geometrical parameters, one may achieve more area reduction. The improved SIAD structure has the potential to miniaturize many planar component and antenna applications at low cost.