• DocumentCode
    3484960
  • Title

    WSN Monitoring for Agriculture: Comparing SNMP and Emerging CoAP Approaches

  • Author

    Paventhan, A. ; Krishna, Sai ; Krishna, Hari ; Kesavan, R. ; Ram, N. Mohan

  • Author_Institution
    ERNET India R&D Centre, Bangalore, India
  • fYear
    2013
  • fDate
    4-6 April 2013
  • Firstpage
    353
  • Lastpage
    358
  • Abstract
    The IPv6 protocol adaptation for the Wireless Sensor Network (6LoWPAN) enables the reuse of the TCP/IP application layer in WSN environment. It has been shown that the Simple Network Management Protocol (SNMP) originally envisioned for monitoring & managing hosts on the internet can be adapted for the 6LoWPAN networks. Also, IETF Constrained Application Protocol (CoAP), designed specifically for machine-to-machine application scenario, is emerging as an open application layer specification for resource constrained networks. In this paper, we compare SNMP and CoAP-based WSN monitoring approaches in agricultural field deployments connecting to ERNET IPv6 backbone network. We present the results comparing these two approaches in terms of protocol features, ease-of-use and memory footprint.
  • Keywords
    IP networks; agriculture; personal area networks; transport protocols; wireless sensor networks; 6LoWPAN; CoAP-based WSN monitoring; ERNET IPv6 backbone network; IETF constrained application protocol; IPv6 protocol adaptation; SNMP; TCP/IP application layer; WSN environment; agricultural field deployments; ease-of-use; machine-to-machine application scenario; memory footprint; open application layer specification; protocol features; resource constrained networks; simple network management protocol; wireless sensor network; Agriculture; Logic gates; Monitoring; Protocols; Servers; Soil; Wireless sensor networks; 6LoWPAN; CoAP; SNMP;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    India Educators' Conference (TIIEC), 2013 Texas Instruments
  • Conference_Location
    Bangalore
  • Type

    conf

  • DOI
    10.1109/TIIEC.2013.69
  • Filename
    6757167