DocumentCode :
3485043
Title :
Ultra Low Power and Cost Effective Wireless Instrumentation and Telemetry Support System for Solar Mobility Applications
Author :
Singh, Jaspreet ; Gupta, Rohit ; Rizwan, M.
Author_Institution :
Delhi Technol. Univ., New Delhi, India
fYear :
2013
fDate :
4-6 April 2013
Firstpage :
374
Lastpage :
378
Abstract :
Telemetry is a technology that allows data measurements to be made at a distance either through wired or wireless communication interfaces. Systems that need external instructions and data to operate require the counterpart of telemetry known as telecommand. The main objective of the project was to develop and integrate a low power and cost effective telemetry and telecommand system. The project involves development of an instrumentation unit for collecting various sensor parameters from multiple remote station (e.g. Voltage, Temperature, Humidity etc.) and wireless transfer of the data to a central station. The data thus obtained will be available to the user via a Graphic User Interface running on a Windows based system developed by the team. The GUI will not only enable the user to view the data but also control various sub systems connect to the other end of the device depending upon the parameters obtained.
Keywords :
computerised instrumentation; control engineering computing; graphical user interfaces; telemetry; wireless sensor networks; GUI; Windows; data measurement; graphic user interface; multiple remote station; sensor parameter; solar mobility application; telecommand system; telemetry support system; wired communication interface; wireless communication interface; wireless data transfer; wireless instrumentation; Graphical user interfaces; Microcontrollers; Portable computers; Telemetry; Visualization; Wireless communication; Wireless sensor networks; Data Acquisition; Multinodal Wireless Systems; Wireless Telemetry;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
India Educators' Conference (TIIEC), 2013 Texas Instruments
Conference_Location :
Bangalore
Type :
conf
DOI :
10.1109/TIIEC.2013.73
Filename :
6757171
Link To Document :
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