• DocumentCode
    3485358
  • Title

    Research on a New Composite Ultrasonic Energy Transmission Mechanism with Parallel Structure

  • Author

    Liu, Yanjie ; Zhang, Lemin ; Wang, Dongcui ; Liu, Yuetao

  • Author_Institution
    State Key Lab. of Robot. & Syst., Harbin Inst. of Technol., Harbin
  • fYear
    2008
  • fDate
    21-24 Sept. 2008
  • Firstpage
    258
  • Lastpage
    265
  • Abstract
    A composite two-dimension ultrasonic vibration system with parallel structure is presented in this paper for the wire bonding application. Compared with other conventional structures, this one uses the structure of the clamping beam, weakening the horizontal deflection stiffness, instead of the clamping ring, which weakens the coupling effects existing in most parallel structures. By means of the self-locking wedge, the piezoelectric ceramics are effectively preload. The length of the horn is optimized according to the relationship between the magnification ratio and the ratio of the horn length. Through the vibration characteristic analysis and FEA verification, it is proved that this parallel structure can increase the composite output amplitude of the ultrasonic horn and the density of ultrasonic energy, and can complete the bonding at a larger area range so that it will shorten the bonding time and improve the bonding efficiency.
  • Keywords
    clamps; finite element analysis; lead bonding; piezoceramics; ultrasonic bonding; vibrations; FEA verification; clamping beam; composite two-dimension ultrasonic vibration system; horizontal deflection stiffness; parallel structure; piezoelectric ceramics; self-locking wedge; ultrasonic energy transmission mechanism; ultrasonic horn; vibration characteristic analysis; wire bonding; Bonding; Clamps; Flanges; Frequency; Laboratories; Optical coupling; Robots; Vibrations; Welding; Wire; Wire bonding; bonding efficiency; energy density; horizontal deflection stiffness; parallel composite vibration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Robotics, Automation and Mechatronics, 2008 IEEE Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-1675-2
  • Electronic_ISBN
    978-1-4244-1676-9
  • Type

    conf

  • DOI
    10.1109/RAMECH.2008.4681500
  • Filename
    4681500