DocumentCode
3485689
Title
A Si-based Al/AlN/Si mis device and its photo responsivity
Author
Shih, Ming Chang ; Lin, Hsuan Yang ; Tan, Jia Wei ; Chen, Cheng Sen ; Feng, Shih Wei
Author_Institution
Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan
fYear
2010
fDate
13-18 June 2010
Firstpage
279
Lastpage
280
Abstract
We present the fabrication of a silicone based metal-insulator-semiconductor (MIS) device using aluminum nitride (AlN) as the dielectric layer and its characteristics of photo-responsivity. Pulse laser deposition was used to deposit AlN dielectric layer with good surface morphology and interface properties. Current v.s. voltage (I-V) measurements was used to characterize the electro-optic properties of the MIS devices fabricated. A photo-responsivity of 0.75 A/W at 750 nm was achieved of a MIS device with a 9.8 nm thick AlN dielectric layer. In addition, measurements of photo sensitivity of MIS devices with various thickness of the AlN dielectric layer had been performed. It was found that the thinner the AlN dielectric layer of the MIS device the higher the photo-current would be, and the stability of the photo-current of the MIS devices could be effectively improved by thermal annealing the AlN dielectric layer at 600°C.
Keywords
MIS devices; aluminium compounds; elemental semiconductors; photodetectors; pulsed laser deposition; silicon; silicones; surface morphology; Al-AlN-Si; AlN dielectric layer; MIS device; MIS structure photodetector; current voltage measurement; dielectric layer; electro-optic properties; photo responsivity measurements; photocurrent; silicone based metal-insulator-semiconductor device; size 9.8 nm; surface morphology; temperature 600 degC; thermal annealing; Aluminum nitride; Dielectric devices; Dielectric measurements; Lasers and electrooptics; MIS devices; Metal-insulator structures; Optical device fabrication; Optical pulses; Pulsed laser deposition; Surface morphology;
fLanguage
English
Publisher
ieee
Conference_Titel
Precision Electromagnetic Measurements (CPEM), 2010 Conference on
Conference_Location
Daejeon
Print_ISBN
978-1-4244-6795-2
Type
conf
DOI
10.1109/CPEM.2010.5544757
Filename
5544757
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