• DocumentCode
    3485871
  • Title

    Design and integration of 60-GHz grid array antenna in chip package

  • Author

    Sun, M. ; Zhang, Y.P.

  • Author_Institution
    Integrated Syst. Res. Lab., Nanyang Technol. Univ., Singapore
  • fYear
    2008
  • fDate
    16-20 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A novel grid array antenna has been designed and further integrated as a chip-scale package in LTCC for the highly-integrated 60-GHz radios. The novel design concept and sophisticated LTCC process have guaranteed excellent performance of the grid array antenna over the targeted 7-GHz bandwidth from 57 to 67 GHz with a maximum gain of 14.5 dBi and an estimated radiation efficiency better than 90%. The antenna is being fabricated with 9 green types and gold metal in a panel size of 100x100 mm2 by the LTCC Boutique Foundry in SIMTech on the NTU campus. The antenna function of the package will be tested with a probe-based measurement setup at IBM Thomas J. Watson Research Center, USA. The verified results will be presented in the APMC conference.
  • Keywords
    antenna radiation patterns; ball grid arrays; chip scale packaging; integrated circuit design; millimetre wave antenna arrays; LTCC; LTCC Boutique Foundry; SIMTech; chip-scale package; frequency 60 GHz; grid array antenna; probe-based measurement setup; radiation efficiency; Antenna arrays; Antenna feeds; Apertures; Bandwidth; Ceramics; Metallization; Microstrip antenna arrays; Microstrip antennas; Packaging; Receiving antennas;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2008. APMC 2008. Asia-Pacific
  • Conference_Location
    Macau
  • Print_ISBN
    978-1-4244-2641-6
  • Electronic_ISBN
    978-1-4244-2642-3
  • Type

    conf

  • DOI
    10.1109/APMC.2008.4958260
  • Filename
    4958260