Hybrid integration of optical and electronic components on a silicon motherboard

Author

Jones, C.A. ; Cooper, K. ; Nield, M.W. ; Rush, J.D. ; Collins, J.V. ; Hall, I.P. ; McDonna, A.P. ; Brown, S.J.

Author_Institution

British Telecom Res. Labs., Ipswich, UK

Volume

2

fYear

1994

fDate

31 Oct-3 Nov 1994

Firstpage

273

Abstract

We have demonstrated silicon motherboard transmitter and receiver modules with planar silica waveguide optical interconnects. In both modules the active optoelectronic components were passively aligned to the silica waveguides, and electronic circuitry was also hybrid integrated. We are now- developing motherboards which include an electrical interconnect layer formed directly on the silicon, in order to overcome the limitations encountered with bond-wires

Keywords

silicon; Si; SiO₂; active optoelectronic components; electrical interconnect layer; electronic circuitry; electronic components; hybrid integrated; hybrid integration; optical components; passively aligned; planar silica waveguide optical interconnects; receiver modules; silicon motherboard; silicon motherboard transmitter modules; Electronic components; Integrated optics; Optical devices; Optical interconnections; Optical planar waveguides; Optical receivers; Optical transmitters; Optical waveguides; Planar waveguides; Silicon compounds;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1994. LEOS '94 Conference Proceedings. IEEE

Conference_Location

Boston, MA

Print_ISBN

0-7803-1470-0

Type

conf

DOI

10.1109/LEOS.1994.586538

Filename

586538